Article · AI translation
IT Home reported on November 10 that, according to the Japan Broadcasting Corporation (NHK), Rapidus President Atsuyoshi Koike said at a forum organized by the Japan External Trade Organization (JETRO) in Sapporo on the 4th of this month, local time, that the company plans to build 3 more factories and 1 research and development base near its existing wafer fabrication plant, forming a semiconductor industry cluster integrating production and research.
Koike said Rapidus’s 2nm manufacturing capability could help curb the growing electricity consumption driven by factors including the spread of artificial intelligence. Its advanced semiconductors are expected to be used in high-performance computing (HPC) fields such as artificial intelligence, including next-generation applications that no one can currently imagine.
IT Home noted that IBM, Rapidus’s advanced process technology partner, recently opened an office in Chitose, where Rapidus’s wafer fabrication plant is located, to support Rapidus and other local partners.