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IT Home reported on October 22 that, according to a TrendForce report published today, Samsung Electro-Mechanics has signed a long-term agreement to supply Tesla with flip-chip ball grid array (FC-BGA) substrates and is expanding a dedicated production line at its Sejong plant.
According to the report, the agreement runs for 5 years, and the substrates produced are expected to be used in AI chips for Tesla electric vehicles and the Optimus humanoid robot. In return, Tesla will provide Samsung Electro-Mechanics with about 1.1 trillion won (IT Home note: approximately 5.549 billion yuan at the current exchange rate) to fund its capacity expansion.
The FC-BGA substrate production facilities at Samsung Electro-Mechanics' Sejong plant are expected to be completed by the end of 2027. Equipment installation and trial operations are planned for the first half of 2028, with mass production to begin in the second half and deliveries expected to start in 2029.
Meanwhile, Nvidia is also working with major suppliers to expand global substrate capacity. Through a series of supply agreements, the company plans to increase its total IC substrate capacity to 2.5 times its current level over the next 3 years.
Nvidia has reportedly prepaid Japan's IBIDEN several billion dollars to reserve capacity. IBIDEN plans to triple capacity at its Ono plant, with the added capacity expected to come online gradually starting in the first quarter of 2028. Samsung Electro-Mechanics is also expanding capacity at its Sejong and Busan plants. By 2028, Nvidia is expected to account for a substantial portion of Samsung Electro-Mechanics' annual packaging substrate capacity.