Article · AI translation
Thanks to IT Home readers Autumn_Dream and 不一样的体验 for the tips!
IT Home reported on November 13 that Huawei Kirin's official WeChat account has continued to reveal more configuration details about the Kirin 9050 series, the first “logic-folding” τ chip. Details of the next-generation Lingxi CPU have now been released.
According to the introduction, the Kirin 9050 series features a next-generation Lingxi CPU with 9 cores and 16 threads and supports hyper-threading technology. Multicore performance is up 23%, GPU rendering performance is up 40%, and NPU performance is up 140%. Together with parallelization of HarmonyOS apps and intelligent scheduling, this makes multitasking smoother.
Heavy workloads (app launches, loading large files, and running games) are handled by 1 super core and 2 high-performance cores; multitasking (UX interactions, floating windows, video calls, and split-screen use) is handled by 4 power-efficient large cores; everyday tasks (browsing news and watching short videos) are handled by 2 small cores.
In addition, the Kirin 9050 series chips support a memory compression accelerator that increases the compression ratio by 45% and adds an average of 3GB of available memory, making background multitasking easier to handle. Intelligent heterogeneous scheduling can improve device battery life, while hardware-based low-latency scheduling makes XPU coordination more efficient.
As IT Home previously reported, at Huawei's 2026 Kirin media briefing held in October this year, Xu Songyu, head of the Wireless Terminal Chip Product Management Department of Huawei's semiconductor business, said that the Kirin 9050 series, as the first logic-folding τ chip, would embark on a new journey over the next 10 years. A presentation slide showed that Huawei aims to raise the P-core frequency above 5GHz by 2031.