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高通将在进博会全球首展 6G 终端原型机

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AI 辅助摘要

高通将在第九届进博会首次公开展示其 6G 终端原型机。该原型机已用于与中国移动、中兴通讯等伙伴的联合技术测试和互操作验证;此前,中国移动与高通还宣布完成基于 U6G 频段的 6G 原型基站与终端原型对接测试。

正文 · AI 翻译

IT Home reported on October 28 that, according to a midday report today (the 28th) by the Science and Technology Innovation Board Daily, the 9th China International Import Expo is about to open. Qualcomm will exhibit for the 9th consecutive year, showcasing its achievements in 6G, agentic AI and a range of smart devices.

Qualcomm will reportedly make the global debut of a 6G device prototype at this year's expo. The prototype has been used in joint 6G technology testing and interoperability verification with Chinese industry partners including China Mobile and ZTE.

The booth will also bring together innovations in agentic AI and a range of smart devices, including agentic devices, the latest flagship smartphones, AI PCs, smart glasses, cars and robots, as well as interactive experiences involving AI imaging and XR.

As IT Home previously reported, on September 20 this year, China Mobile and Qualcomm jointly announced that, at China Mobile's Collaborative Innovation Base, they had successfully completed the world's 1st interconnection test between a 6G prototype base station and a device prototype in the U6G band, as most recently defined by 3GPP, using a 6G open collaborative innovation test platform. This marks a new stage in which key 6G technologies have moved from research to systematic verification.

Related reading:

“World's 1st: China Mobile and Qualcomm Complete Interconnection Test Between a 6G Prototype Base Station and Device Prototype in the U6G Band”

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