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Amkor has held a groundbreaking ceremony for an expansion at its Gwangju plant to serve advanced packaging demand for AI and high-performance computing chips. The report says the first two buildings are expected to be completed in the second half of 2027 and two more in the first half of 2028, with mass production to follow. The project is expected to create 3,000 jobs.
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IT之家 10 月 19 日消息，头部 OSAT 企业 Amkor（安靠）当地时间今日在其韩国光州工厂举行扩建项目奠基仪式。该项目将服务于 AI / HPC 芯片的先进封装需求。
IT之家了解到，该项目投资规模达到 3 万亿韩元（IT之家注：现汇率约合 149.79 亿元人民币），将创造 3,000 个就业岗位，预计 2027H2 建成首批 2 座厂房、2028H1 建成另 2 座，此后开始批量生产。
Amkor 总部当前位于美国，但其最早可追溯到一家韩国企业，韩国也是其全球产能布局的重要一环。Amkor 去年底在韩国仁川开始建设一家先进测试工厂。